Fine Pitch Ball Grid Array

Product Overview

ASE's FBGA (Fine Pitch Ball Grid Array) is a laminate substrate based CSP and near chip-size standard outlines and an array of fine pitch solder ball terminals. The FBGA package uses standard assembly technology and established SMT mounting processes and techniques are compatible with it. This package provides downsized outline and high dense design with low inductance for high-speed application requiring small footprints. ASE's FBGA is available in lead free and halogen free compatible material sets and JEDEC standard body sizes.

Application

• Microprocessors / Controllers
• RF devices
• Analog
• Logic
• ASIC
• Memory
• Simple PLDs
• Others

Features

• Thinner, lighter and smaller CSP
• 8~500 ball count
• 3.0~19.0mm body size
• 0.50, 0.65, 0.75, 0.80, 1.0mm ball pitch
• BT laminate or equivalent (2 and 4 metal layers)
• High electrical and thermal performance
• Eutectic & Pb free solder balls
• Green package options available
• JEDEC standard compliant: LFBGA(1.4mm max.)/TFBGA(1.2mm max.)/VFBGA(1.0mm max.)

Specification

• Die thickness: 75um~300um (3~12mils)
• Marking: Laser
• Ball inspection: Optical
• Wafer thinning: Available
• Pack option: Dry pack
• Package substrate
  -Layer: 2~4 layer
  -Dielectric: Laminate (BT or equivalent)
• Die attach adhesive: High adhesion/low modulus adhesive material
• Encapsulant: Low stress epoxy material
• Solder ball: Eutectic SnPb / Lead free

Shipping

Tape and reel or trays