Pressure Sensor-Open Cavity Surface Mount

Pressure sensor surface mount package

Pressure sensor open cavity small outline package incorporates the most advanced assembly processes and designs for high cost/ performance applications providing the unique designs to implement various pressure sensor applications and devices requiring open cavity packages. The use of proven, reliable materials, coupled with statistically controlled processes, assure long term, excellent operation of your applications.

Applications

• Automotive and industrial pressure sensors.
• Pump/Motor controllers
• Robotics/Engine control systems
• Level indicators/Pressure switching
• Medical instrumentation
• Barometers/Altimeters
• Air movement controllers/leak detection
• Environment/Pneumatic control systems
• Devices requiring open cavity packages
  

Features

• Custom packages
• Open cavity
• Through hole type package
• Absolute, differential and gauge configurations
• Ideally suited package for pressure sensor devices
• Large reduction in weight and volume compared to existing hybrid modules
• Easy to use chip carrier package options
  

Process Highlights

• Pre-mold process & pre-plate lead frame
• Full automated dicing saw
• Law stress die bond/packaging for MEMS chip
• Gold ball bond up to 2mil
• Die coat without pressure transmission error
• Cleaning room environment for medical product
• Class zero ESD control for MEMS chip
• Precise process control for MEMS chip assembly

Shipping

• Clear tray/tube/tape & reel
• Drop ship

Services Available

• Product engineering
• Tri-temp test capability with pressure(10kpa-10000kpa)
• Laser trim/Eprom program
• Test data management
• Burn-in
• Various ports
• Reliability test

Reliability

• Temperature cycling(TC): -40 to 125 deg.C
• High temperature storage lift(HTSL):TA=125 deg.C
• High temperature bias(HTB):TA=125 deg C rated forward voltage
• High humidity high temperature bias testing(H3TB):TA=85 deg. C,RH=85%, rated forward voltage
• Low temperature storage Lift(LTSL):TA+/-40 deg.
• Physical pressure temperature cycling bais(PPTCB);TA=-40 to 125 deg. C with bias.