Automotive Power

Model Number

HOSP

Power Flat Packages

The Heat Slug Automotive Power Packages has various package type of HSOP20,HSOP30,HSOP44,HSIP15,HSIP23,PFP16 and PFP48. All package types have exposed heat slug down version so chips are directly attached on the PCB for all HSOP and SIP 15 SMT package or used for through-hole type for SIP package.It results in an increased ability to dissipate heat so they have very low Theta Ja and Theta Jc. Among them PFP16 package is used for cellular phone and others are used for automobile.

Applications

• Air bag : PFP48
• Cellular phone : PFP16
  

Features

• ASE Korea's Power packages offer
  
  • Heat slug soldered to board : HSOP:20,30,36,44 lead
    
  • Through hole type : None
    
  • Highly conductive copper heat slug and lead frame
    
  • All solder die attach and have epoxy die attach capability
    
  • Copper wire bonding capability on HSOP20/30 leads
    
  • Very low Theta Ja and Theta Jc on heat slug soldered to board package
    
  • Thermal Resistance(Deg.°C/W)

Process Highlights

• Auto Mount & Full auto dicing saw
• Solder Die Attachment
• Pre-Plated lead frame(Ni/Pd or Ni/Pd/Au)and also provide post plating service.
• Gold wire ball bond up to 3mil
• Copper wire bonding capable up to 2mil
• Auto mold
• Moisture sensitivity level 1 capable
• In-line marking,trim,and form with vision system
• Various lead form options
• lead free package at 260 C re-flow

Shipping

• Tray,tube or tape & reel
• Drop ship

Services Available

• Hardware/Tool development and maintenance
• Test data management
• Tri-temp test capability
• Burn-in on both static and dynamic mode
• Auto version system-Marking and lead inspection
• Dry pack according to moisture sensitivity level

Reliability

Hast	135C,85%RH,bias
Autoclave(PTH)	121C,100%RH,15PSIG
Temp cycle	-65 C to 150 C(air to air)
Thermal chock	-65 C to 200 C(liquid to liquid)
High temp storage	150 C
High temp bias(HTB)	150 C with rated bias
H3TB	85%RH 85C with bias
H3T	85%RH 85C,30%RH/60C
	30%RH 90C,60%RH/90C
Zyglo	Pressure at 60/100 PSIG
Vibration test	-73 to 177 at 5G
Mechanical shock	1500G's
SAT
Salt atmosphere	All level
ESD	MM,HBM
Solder ability	8hrs steam aging
HTOL	145C, bias
Drop test	1.2Meter